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MMZ1608B121C 参数 Datasheet PDF下载

MMZ1608B121C图片预览
型号: MMZ1608B121C
PDF下载: 下载PDF文件 查看货源
内容描述: 片式磁珠( SMD )为信号线 [Chip Beads(SMD) For Signal Line]
分类和应用: 数据线路滤波器过滤器PC
文件页数/大小: 8 页 / 218 K
品牌: TDK [ TDK ELECTRONICS ]
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(1/8)  
Conformity to RoHS Directive  
Chip Beads(SMD)  
For Signal Line  
MMZ Series MMZ1608 Type  
FEATURES  
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD  
• Chip bead(impeder), MMZ series offers 7 construction materials.  
• Size standardized for use by automatic assembly equipment.  
No preferred orientation.  
PATTERN  
1.6 0.15  
• Either flow or reflow soldering methods can be used due to  
electroplating of the terminal electrodes.  
0.6  
0.8  
0.6  
0.3 0.2  
• High reliability due to an entirely monolithic structure.  
• Closed magnetic circuit structure allows high-density installation  
while preventing crosstalk between circuits.  
• Low DC resistance structure of electrode prevents wasteful  
electric power consumption.  
( )  
Thickness T Weight  
0.6 0.15mm  
0.8 0.15mm  
3mg  
4mg  
Dimensions in mm  
• The products contain no lead and also support lead-free  
soldering.  
TEMPERATURE RANGES  
Operating/storage –55 to +125°C  
• It is a product conforming to RoHS directive.  
PACKAGING STYLE AND QUANTITIES  
Packaging style  
Quantity  
APPLICATIONS  
Taping  
4000 pieces/reel  
Removal of signal line noises of cellular phones, PCs, note PCs,  
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game  
machines, digital photo frames, car navigation system, PNDs, etc.  
RECOMMENDED SOLDERING CONDITION  
REFLOW SOLDERING  
PRODUCT IDENTIFICATION  
10s max.  
MMZ 1608  
R
121  
A
T
250 to 260˚C  
230˚C  
(1) (2) (3) (4) (5) (6)  
Natural  
cooling  
(1) Series name  
(2) Dimensions L×W  
(3) Material code  
(4) Nominal impedance  
121:120at 100MHz  
(5) Characteristic type  
(6) Packaging style  
T:Taping  
180˚C  
150˚C  
Preheating  
60 to 120s  
Soldering  
30 to 60s  
Time(s)  
HANDLING AND PRECAUTIONS  
• Before soldering, be sure to preheat components. The preheat-  
ing temperature should be set so that the temperature difference  
between the solder temperature and product temperature does  
not exceed 150°C.  
• After mounting components onto the printed circuit board, do not  
apply stress through board bending or mishandling.  
• Do not expose the inductors to stray magnetic fields.  
• Avoid static electricity discharge during handling.  
• When hand soldering, apply the soldering iron to the printed cir-  
cuit board only. Temperature of the iron tip should not exceed  
350°C. Soldering time should not exceed 3 seconds.  
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific  
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.  
• Please contact our Sales office when your application are considered the following:  
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)  
• All specifications are subject to change without notice.  
012-01 / 20100324 / e9412_mmz1608.