欢迎访问ic37.com |
会员登录 免费注册
发布采购

MLG1005S82NJT 参数 Datasheet PDF下载

MLG1005S82NJT图片预览
型号: MLG1005S82NJT
PDF下载: 下载PDF文件 查看货源
内容描述: SMD电感器(线圈),高频(多层) [SMD Inductors(Coils) For High Frequency(Multilayer)]
分类和应用: 电感器固定电感器测试射频感应器
文件页数/大小: 6 页 / 78 K
品牌: TDK [ TDK ELECTRONICS ]
 浏览型号MLG1005S82NJT的Datasheet PDF文件第2页浏览型号MLG1005S82NJT的Datasheet PDF文件第3页浏览型号MLG1005S82NJT的Datasheet PDF文件第4页浏览型号MLG1005S82NJT的Datasheet PDF文件第5页浏览型号MLG1005S82NJT的Datasheet PDF文件第6页  
(1/6)  
Conformity to RoHS Directive  
SMD Inductors(Coils)  
For High Frequency(Multilayer)  
MLG Series MLG1005S Type  
FEATURES  
PRODUCT IDENTIFICATION  
MLG 1005 2N2  
(1) (2) (3) (4) (5) (6)  
• Nominal inductance values are supported from 0.3 to 390nH.  
• Provides high Q characteristics.  
S
S
T
• Advanced monolithic structure is formed using a multilayering  
and sintering process with ceramic and conductive materials for  
high-frequency.  
(1) Series name  
(2) Dimensions  
1005  
• The products contain no lead and also support lead-free  
soldering.  
1.0× 0.5mm (L× W)  
• It is a product conforming to RoHS directive.  
(3) Material code  
APPLICATIONS  
(4) Inductance value  
For high-frequency applications including mobile phones, high  
frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB  
and tuners.  
2N2  
12N  
R10  
2.2nH  
12nH  
100nH  
(5) Inductance tolerance  
SHAPES AND DIMENSIONS  
B
C
S
H
J
0.1nH  
0.2nH  
0.3nH  
3%  
1.0 0.05  
5%  
(6) Packaging style  
T
Taping (reel)  
0.25 0.1  
SPECIFICATIONS  
Operating temperature range  
Storage temperature range  
–55 to +125°C  
–55 to +125°C [Unit of products]  
Weight: 1mg  
PACKAGING STYLE AND QUANTITIES  
RECOMMENDED PC BOARD PATTERN  
Packaging style  
Taping  
Quantity  
10000 pieces/reel  
HANDLING AND PRECAUTIONS  
• Before soldering, be sure to preheat components.  
The preheating temperature should be set so that the  
temperature difference between the solder temperature and  
product temperature does not exceed 150°C.  
0.4 to 0.5 0.4 to 0.5 0.4 to 0.5  
Dimensions in mm  
RECOMMENDED SOLDERING CONDITION  
REFLOW SOLDERING  
• After mounting components onto the printed circuit board, do not  
apply stress through board bending or mishandling.  
• When hand soldering, apply the soldering iron to the printed  
circuit board only. Temperature of the iron tip should not exceed  
350°C. Soldering time should not exceed 3 seconds.  
10s max.  
250 to 260˚C  
230˚C  
Natural  
cooling  
180˚C  
150˚C  
Preheating  
60 to 120s  
Soldering  
30 to 60s  
Time(s)  
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific  
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.  
• Please contact our Sales office when your application are considered the following:  
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)  
• All specifications are subject to change without notice.  
006-01 / 20070703 / e521_mlg1005.