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Creation Date : June 30, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGA5L1X7S1A226M160AC
TDK item description CGA5L1X7S1A226MT****
Applications
Feature
Automotive Grade
General General (Up to 50V)
AEC-Q200 AEC-Q200
Series
Status
CGA5(3216) [EIA 1206]
Production
Size
3.20mm +0.30,-0.10mm
Length(L)
Width(W)
1.60mm +0.30,-0.10mm
1.60mm +0.30,-0.10mm
0.20mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
1.00mm Min.
2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reflow Soldering)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reflow Soldering)
1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reflow Soldering)
Electrical Characteristics
Capacitance
22μF ±20%
10VDC
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
X7S(±22%)
7.5%
4MΩ
Other
Wave (Flow)
Reflow
Soldering Method
AEC-Q200
Yes
Packing
Blister (Plastic)Taping [180mm Reel]
2000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
TDK [ TDK ELECTRONICS ]
