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Creation Date : June 22, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGA3E1X7R1V684M080AC
TDK item description CGA3E1X7R1V684MT****
Applications
Feature
Automotive Grade
General General (Up to 50V)
AEC-Q200 AEC-Q200
Series
Status
CGA3(1608) [EIA 0603]
Production
Size
1.60mm ±0.10mm
Length(L)
Width(W)
0.80mm ±0.10mm
0.80mm ±0.10mm
0.20mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
0.30mm Min.
0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Electrical Characteristics
Capacitance
680nF ±20%
35VDC
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
X7R(±15%)
5%
735MΩ
Other
Wave (Flow)
Reflow
Soldering Method
AEC-Q200
Yes
Packing
Punched (Paper)Taping [180mm Reel]
4000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
TDK [ TDK ELECTRONICS ]
