TSL230R−LF, TSL230AR−LF, TSL230BR−LF
PROGRAMMABLE LIGHT-TO-FREQUENCY CONVERTERS
TAOS079A
−
OCTOBER 2006
MECHANICAL INFORMATION
This dual-in-line package consists of an integrated circuit mounted on a lead frame and encapsulated with an
electrically nonconductive clear plastic compound. The photodiode area is typically 0.92 mm
2
(0.0014 in
2
)
(S0 = S1 = H).
0.440 (11,18)
0.420 (10,67)
8
C
7 L 6
5
Center of active
C area coincides
L with package
center
1
2
3
4
0.260 (6,60)
0.240 (6,10)
0.310 (7,87)
0.290 (7,37)
0.260 (6,60)
0.240 (6,10)
0.075 (1,91)
0.060 (1,52)
10°
j
0.30 (0,76) NOM
0.016 (0,41)
0.014 (0,36)
Die Thickness
0.10 (2,54)
8°
0.053 (1,35)
0.043 (1,09)
0.175 (4,45)
0.155 (3,94)
0.130 (3,30)
0.120 (3,05)
Seating Plane
100°
90°
8°
8°
0.012 (0,30)
0.008 (0,20)
0.060 (1,52)
0.040 (1,02)
0.025 (0,64)
0.015 (0,38)
0.150 (3,81)
0.125 (3,18)
Pb
NOTES: A.
B.
C.
D.
All linear dimensions are in inches and (millimeters).
Index of refraction of clear plastic is 1.55.
Lead finish is NiPd.
This drawing is subject to change without notice.
Figure 6. Plastic Dual-In-Line Packaging Configuration
The
LUMENOLOGY
r
Company
r
r
Copyright
E
2006, TAOS Inc.
www.taosinc.com
7
TAOS [ TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS ]
