TSL1402R
256 × 1 LINEAR SENSOR ARRAY WITH HOLD
TAOS041F − APRIL 2007
MECHANICAL INFORMATION
This assembly consists of 2 sensor chips mounted on a printed-circuit board in a clear molded plastic package.
TOP VIEW
19.30
18.29
Sensors
C
L
10.67
9.65
Sensors 3.62
to Pin 1 3.92
0.53
0.28
Pixel 1
to Pin 1
Pin 1
Indicator
END VIEW
SIDE VIEW
3.18
2.79
Top of Die to 0.89
Top of Package 1.29
0.50
0.00
14 y
14 y 4.60 MIN
0.508
0.406
14 y j
BOTTOM
VIEW
1.90
0.76
1
2
3
4
5
6
7
8
7.87
7.37
14
13
12
11
10
9
2.16
1.42
2 y
12 y 2.54
Nonaccumulative
See Note B
NOTES: A. All linear dimensions are in millimeters.
B. The true-position spacing is 2.54 mm between lead centerlines. Each pin centerline is located within 0.25 mm of its true
longitudinal positions.
C. Index of refraction of clear plastic is 1.52.
D. The gap between the individual sensor dies in the array is 57 μm typical (51 μm minimum and 75 μm maximum).
E. This drawing is subject to change without notice.
Figure 11. Packaging Configuration
Copyright E 2007, TAOS Inc.
The LUMENOLOGY r Company
r
r
12
www.taosinc.com
TAOS [ TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS ]
