SLAS687A – FEBRUARY 2013 – REVISED FEBRUARY 2013
Table 2-1. RGE PIN FUNCTIONS (continued)
PIN
NAME
MISO
GPIO/DOUT
SCL/SSZ
SDA/MOSI
SCLK
IOVDD
DVDD
DVSS
NO.
17
18
19
20
21
22
23
24
I/O
(1)
O
I/O/Z
I
I
I
PWR
PWR
GND
SPI Serial Data Output
GPIO / Audio Serial Bus Output
Either I2C Input Serial Clock or SPI Chip Select Signal depending on SPI_SEL state
Either I2C Serial Data Input or SPI Serial Data Input depending on SPI_SEL state.
Serial clock for SPI interface
I/O Power Supply, 1.1V - 3.6V
Digital Power Supply, 1.65V - 1.95V
Digital Ground, 0V
DESCRIPTION
3 ELECTRICAL SPECIFICATIONS
3.1
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
MIN
AVDD to AVSS
DVDD to DVSS
SPKVDD to SPKVSS
IOVDD to IOVSS
Digital input voltage
Analog input voltage
Operating temperature range
Storage temperature range
Junction temperature (T
J
Max)
QFN
(1)
Power dissipation(with thermal pad soldered to board)
–0.3
–0.3
–0.3
–0.3
IOVSS – 0.3
AVSS – 0.3
–40
–55
MAX
2.2
2.2
6
3.9
IOVDD + 0.3
AVDD + 0.3
85
150
105
(T
J
Max – T
A
) /
θ
JA
UNIT
V
V
V
V
V
V
°C
°C
°C
W
Stresses beyond those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating
Conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
3.2
THERMAL INFORMATION
THERMAL METRIC
(1)
TAS2521
RGE (24 PINS)
32.2
30.0
9.2
0.3
9.2
2.2
°C/W
UNITS
θ
JA
θ
JCtop
θ
JB
ψ
JT
ψ
JB
θ
JCbot
(1)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report,
4
ELECTRICAL SPECIFICATIONS
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