DS90UB913Q, DS90UB914Q
www.ti.com
SNLS420B –JULY 2012–REVISED APRIL 2013
DS90UB914Q Deserializer Pin Descriptions (continued)
Pin Name
Pin No.
17
I/O, Type
Description
VDDD
Power, Digital Digital Core Power, 1.8V ±5%
Power, Analog SSCG PLL Power, 1.8V ±5%
Power, Analog Rx Analog Power, 1.8V ±5%
VDDSSCG
VDDR
3
36
VDDCML0/1
VDDPLL
40,31
45
Power, Analog CML and Bidirectional control channel Drive Power, 1.8V±5%
Power, Analog PLL Power, 1.8V ±5%
DAP must be grounded. DAP is the large metal contact at the bottom side, located at
Ground, DAP the center of the WQFN package. Connected to the ground plane (GND) with at least
16 vias.
VSS
DAP
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage – VDDn (1.8V)
−0.3V to +2.5V
−0.3V to +4.0V
Supply Voltage – VDDIO
LVCMOS Input Voltage I/O Voltage
−0.3V to + (VDDIO + 0.3V)
−0.3V to +(VDD + 0.3V)
−0.3V to (VDD + 0.3V)
+150°C
CML Driver I/O Voltage (VDD
)
CML Receiver I/O Voltage (VDD
)
Junction Temperature
Storage Temperature
−65°C to +150°C
1/θJA °C/W above +25°
38.4 °C/W
Maximum Package Power Dissipation Capacity Package
Package Derating:
θJA(based on 16 thermal vias)
DS90UB913Q 32 Lead WQFN
θJC(based on 16 thermal vias)
θJA(based on 16 thermal vias)
θJC(based on 16 thermal vias)
6.9 °C/W
DS90UB914Q 48 Lead WQFN
26.9 °C/W
4.4 °C/W
ESD Rating (IEC 61000-4-2)
RD = 330Ω, CS = 150pF
Air Discharge
(DOUT+, DOUT-, RIN+, RIN-)
≥±25 kV
≥±7 kV
Contact Discharge
(DOUT+, DOUT-, RIN+, RIN-)
ESD Rating (ISO10605)
ESD Rating (ISO10605)
RD = 330Ω, CS = 150/330pF
RD = 2KΩ, CS = 150/330pF
Air Discharge
(DOUT+, DOUT-, RIN+, RIN-)
≥±15 kV
≥±8 kV
Contact Discharge
(DOUT+, DOUT-, RIN+, RIN-)
ESD Rating (HBM)
ESD Rating (CDM)
ESD Rating (MM)
≥±8 kV
≥±1 kV
≥±250 V
For soldering specifications: see product folder at www.ti.com and www.ti.com/lit/an/snoa549c/snoa549c.pdf
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional; the device should not be operated beyond such conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Copyright © 2012–2013, Texas Instruments Incorporated
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