AMC7812B
SBAS625A –SEPTEMBER 2013–REVISED SEPTEMBER 2013
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range, unless otherwise noted.
VALUE
–0.3 to +6
UNIT
V
AVDD to GND
DVDD to GND
–0.3 to +6
V
IOVDD to GND
–0.3 to +6
V
AVCC to GND
–0.3 to +18
–0.3 to +6
V
DVDD to DGND
V
Analog input voltage to GND
ALARM, GPIO-0, GPIO-1, GPIO-2, GPIO-3, SCLK/SCL, and SDI/SDA to GND
D1+/GPIO-4, D1–/GPIO-5, D2+/GPIO-6, D2–/GPIO-7 to GND
Digital input voltage to DGND
SDO and DAV to GND
–0.3 to AVDD + 0.3
–0.3 to +6
V
V
–0.3 to AVDD + 0.3
–0.3 to IOVDD + 0.3
–0.3 to IOVDD + 0.3
–40 to +125
–40 to +150
+150
V
V
V
Operating temperature range
Storage temperature range
Junction temperature range (TJ max)
°C
°C
°C
kV
kV
Human body model (HBM)
2.5
Electrostatic discharge (ESD)
ratings
Charged device model (CDM)
1.0
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
THERMAL INFORMATION
AMC7812B
THERMAL METRIC(1)
RGC (QFN)
64 PINS
24.1
PAP (HTQFP)
UNITS
64 PINS
33.7
9.5
θJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
θJCtop
θJB
8.1
3.2
9.0
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.1
0.3
ψJB
3.3
8.9
θJCbot
0.6
0.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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