PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
5962-9202201MXA
Status
(1)
Package Type Package Pins Package
Drawing
Qty
CFP
WD
48
1
Eco Plan
(2)
Lead/Ball Finish
Call TI
MSL Peak Temp
(3)
Op Temp (°C)
-55 to 125
Top-Side Markings
(4)
Samples
ACTIVE
TBD
Call TI
5962-9202201MX
A
SNJ54ACT16244W
D
ACT16244
ACT16244
ACT16244
ACT16244
ACT16244
ACT16244
ACT16244
5962-9202201MX
A
SNJ54ACT16244W
D
74ACT16244DGGR
74ACT16244DGGRE4
74ACT16244DGGRG4
74ACT16244DL
74ACT16244DLG4
74ACT16244DLR
74ACT16244DLRG4
SNJ54ACT16244WD
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
SSOP
SSOP
SSOP
SSOP
CFP
DGG
DGG
DGG
DL
DL
DL
DL
WD
48
48
48
48
48
48
48
48
2000
2000
2000
25
25
1000
1000
1
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
A42
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-55 to 125
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability
information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 1
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