8. Recommended Reflow Soldering Profile
AP.10G can be assembled following Pb-free assembly. According to the Standard
IPC/JEDEC J-STD-020C, the temperature profile suggested is as follow:
Pb-Free Assembly
Phase
Profile Features
Temperature Min(Tsmin)
Temperature Max(Tsmax)
Time(ts) from (Tsmin to Tsmax)
Avg. Ramp-up Rate (Tsmax to TP)
Temperature(TL)
(SnAgCu)
150°C
PREHEAT
200°C
60-120 seconds
3°C/second(max)
217°C
RAMP-UP
REFLOW
Total Time above TL (tL)
Temperature(TP)
30-100 seconds
260°C
PEAK
Time(tp)
2-5 seconds
RAMP-DOWN
Rate
3°C/second(max)
8 minutes max.
96.5Sn/3Ag/0.5Cu
SHENMAO PF606-P26
Time from 25°C to Peak Temperature
Composition of solder paste
Solder Paste Model
Soldering Iron condition: Soldering iron temperature 270°C±10°C.
Apply preheating at 120°C for 2-3 minutes. Finish soldering for each terminal within 3 seconds, if soldering iron
temperature over270°C±10°C or 3 seconds, it will make cause component surface peeling or damage.
SPE-11-8-100/E/SS Page 11 of 12
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