The XENSIV™ TLE4999I3 provides all means that are necessary to fulfill the state-of-the-art functional safety requirements on system level. It is developed in full compliance with ISO 26262. The device provides high redundancy on one chip by means of two sensor elements included within one monolithic silicon design. The two diverse Hall sensor elements („main” and „sub”) have internally separated signal paths within the chip. A plausibility check secures the high diagnostic coverage required for premium functional safety compliant systems up to ASIL-D.
EasyBRIDGE 1 2200 V, 50 A Diode Bridge Module with 1700 V TRENCHSTOP™ IGBT4 Brake Chopper, PressFIT contact technology and pre-applied Thermal Interface Material. The DDB6U50N22W1RP_B11 extends the current easy drive rectifier diode portfolio up to 2.2 kV.
