■ RELIABILITY DATA
14. Solderability
BRC1608, BRL2012, BRC2016, BRC2518,
BRFL2518, BRL2518, BRL3225 Type
NR30/40/50/60/80, NRV30, NRG40,
NRH24/30, NRS50/60 Type
At least 90％ of surface of terminal electrode is covered by new solder.
NR10050 Type
【Test Method and Remarks】
BRC1608, BRL2012, BRC2016, BRC2518, BRFL2518, BRL2518, BRL3225 Type, NR30/40/50/60/80, NRV30, NRG40, NRH24/30, NRS50/60 Type, NR10050Type :
The test samples shall be dipped in flux, and then immersed in molten solder as shown in below table.
Flux : Methanol solution containing rosin 25%.
NR30/40/50/60/80, NRV30, NRG40, NRH24/30, NRS50/60 Type :
Solder Temperature
Time
245±5℃
5±1.0 sec.
BRC1608, BRL2012, BRC2016, BRC2518, BRFL2518, BRL2518, BRL3225 Type :
Solder Temperature
Time
245±5℃
5±0.5 sec.
※Immersion depth : All sides of mounting terminal shall be immersed.
15. Resistance to soldering heat
BRC1608, BRL2012, BRC2016, BRC2518,
BRFL2518, BRL2518, BRL3225 Type
Inductance change : Within ±10%
NR30/40/50/60/80, NRV30, NRG40,
No significant abnormality in appearance.
NRH24/30, NRS50/60 Type
NR10050 Type
【Test Method and Remarks】
BRC1608, BRL2012, BRC2016, BRC2518, BRFL2518, BRL2518, BRL3225 Type :
3 times of reflow oven at 230℃ MIN. for 40sec. with peak temperature at 260ー＋05 ℃ for 5sec.
NR30/40/50/60/80, NRV30, NRG40, NRH24/30, NRS50/60 Type, NR10050 Type
:
The test sample shall be exposed to reflow oven at 230±5℃ for 40 seconds, with peak temperature at 260±5℃ for 5 seconds, 2 times.
NR6020 Type :
The test sample shall be exposed to reflow oven at 230±5℃ for 40 seconds, with peak temperature at 250ー＋05 ℃ for 5 seconds, 2 times.
Test board thickness : 1.0mm
Test board material : glass epoxy-resin
16. Thermal shock
BRC1608, BRL2012, BRC2016, BRC2518,
BRFL2518, BRL2518, BRL3225 Type
Inductance change : Within ±10%
NR30/40/50/60/80, NRV30, NRG40,
No significant abnormality in appearance.
NRH24/30, NRS50/60 Type
NR10050 Type
【Test Method and Remarks】
BRC1608, BRL2012, BRC2016, BRC2518, BRFL2518, BRL2518, BRL3225 Type, NR30/40/50/60/80, NRV30, NRG40, NRH24/30, NRS50/60 Type, NR10050 Type :
The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified time by step 1 to step 4 as shown
in below table in sequence. The temperature cycle shall be repeated 100 cycles.
Conditions of 1 cycle
Step
Temperature (℃)
ー40±3
Room temperature
Duration (min)
30±3
Within 3
1
2
3
4
＋85±2
Room temperature
30±3
Within 3
17. Damp heat
BRC1608, BRL2012, BRC2016, BRC2518,
BRFL2518, BRL2518, BRL3225 Type
Inductance change : Within ±10%
No significant abnormality in appearance.
NR30/40/50/60/80, NRV30, NRG40,
NRH24/30, NRS50/60 Type
NR10050 Type
【Test Method and Remarks】
BRC1608, BRL2012, BRC2016, BRC2518, BRFL2518, BRL2518, BRL3225 Type :
Temperature
Humidity
Time
60±2℃
90～95%RH
1000 hours.
Recovery : At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
NR30/40/50/60/80, NRV30, NRG40, NRH24/30, NRS50/60 Type :
The test samples shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table.
Temperature
Humidity
Time
60±2℃
90～95%RH
500±24hour
＊This catalog contains the typical specification only due to the limitation of space. When you consider purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
wound0407_reli_e-01
wound0407_reli-RP3
TAIYO YUDEN [ TAIYO YUDEN (U.S.A.), INC ]
