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AMK212BBJ473KL-T 参数 Datasheet PDF下载

AMK212BBJ473KL-T图片预览
型号: AMK212BBJ473KL-T
PDF下载: 下载PDF文件 查看货源
内容描述: 有关本公司产品的注意事项 [Notice for TAIYO YUDEN products]
分类和应用:
文件页数/大小: 51 页 / 1328 K
品牌: TAIYO YUDEN [ TAIYO YUDEN (U.S.A.), INC ]
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PRECAUTIONS  
Precautions on the use of Multilayer Ceramic Capacitors  
1. Circuit Design  
Verification of operating environment, electrical rating and performance  
1.A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications.  
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general pur-  
pose applications.  
Operating VoltageVerification of Rated voltage)  
1.The operating voltage for capacitors must always be their rated voltage or less.  
Precautions  
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.  
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.  
2.Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage  
having rapid rise time is used in a circuit.  
2. PCB Design  
Pattern configurationsDesign of Land-patterns)  
1. When capacitors are mounted on PCBs, the amount of solder usedsize of filletcan directly affect the capacitor performance. Therefore, the following items must  
be carefully considered in the design of land patterns:  
1Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper  
amount of solder.  
Precautions  
2When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist.  
Pattern configurations Capacitor layout on PCBs)  
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processesPCB cutting, board inspection,  
mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.. For this reason, land pattern configurations and positions of capacitors  
shall be carefully considered to minimize stresses.  
Pattern configurationsDesign of Land-patterns)  
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.  
1Recommended land dimensions for typical chip capacitors  
Multilayer Ceramic Capacitors : Recommended land dimensionsunit: mm)  
Wave-soldering  
Land patterns for PCBs  
Chip capacitor  
Land  
Type 107  
212  
2.0  
316  
3.2  
1.6  
325  
3.2  
2.5  
L
1.6  
0.8  
Solder-resist  
Size  
W
51.25  
A
0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5  
0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7  
0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5  
C
B
C
B
B
A
Reflow-soldering  
Type 042  
063  
0.6  
0.3  
105  
1.0  
0.5  
107  
1.6  
0.8  
212  
2.0  
316  
3.2  
1.6  
325  
3.2  
2.5  
432  
4.5  
3.2  
Chip capacitor  
L
0.4  
0.2  
Size  
W
51.25  
W
A
0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 1.8 to 2.5 2.5 to 3.5  
0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 1.0 to 1.5 1.5 to 1.8  
0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5  
B
C
L
LWDC: Recommended land dimensions for reflow-solderingunit: mm)  
LWDC  
Type  
105  
0.52  
107  
50.8  
212  
1.25  
L
Size  
W
1.0  
1.6  
2.0  
W
A
0.18 to 0.22  
0.2 to 0.25  
0.9 to 1.1  
0.25 to 0.3  
0.3 to 0.4  
1.5 to 1.7  
0.5 to 0.7  
0.4 to 0.5  
1.9 to 2.1  
B
C
L
Technical  
consider-  
ations  
Array type: Recommended land dimensions for reflow-solderingunit: mm)  
Type 0962 circuits1102 circuits2122 circuits2124 circuits)  
2 circuits  
4 circuits  
Chip capacitor  
L
0.9  
1.37  
2.0  
2.0  
c
c
Size  
W
0.6  
1.0  
1.25  
1.25  
a
b
a
a
b
a
a
0.25 to 0.35  
0.15 to 0.25  
0.15 to 0.25  
0.45  
0.35 to 0.45  
0.55 to 0.65  
0.3 to 0.4  
0.64  
0.5 to 0.6  
0.5 to 0.6  
0.5 to 0.6  
1.0  
0.5 to 0.6  
0.5 to 0.6  
0.2 to 0.3  
0.5  
b
c
d
d
d
Land  
2Examples of good and bad solder application  
Items  
Not recommended  
Recommended  
Mixed mounting of  
SMD and leaded  
components  
Component  
placement close to  
the chassis  
Hand-soldering  
of leaded  
components  
near mounted  
components  
Horizontal  
component  
placement  
To next page  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.  
mlcc_prec_e-01  
mlcc_prec-P1  
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