■ RELIABILITY DATA
12．Resistance to Soldering
Appearance:
No abnormality
Capacitance change:
Dissipation factor :
Insulation resistance:
Within±15%（HMK）, ±10%（QMK, SMK）
Initial value
Initial value
Specified Value
Withstanding voltage（between terminals）: No abnormality
【Test Methods and Remarks】
Preconditioning:Thermal treatmen（t at 150℃ for 1hr） Note1
Solder temperature:270±5℃
Duration:3±0.5sec.
Preheating conditions: 80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5min.
Recovery : 24±2hrs under the standard condition Note3
13．Temperature Cycle（Thermal Shock）
Appearance:
Capacitance change: Within±15%（HMK）, ±7.5%（QMK, SMK）
Dissipation factor: Initial value
No abnormality
Specified Value
Insulation resistance: Initial value
【Test Methods and Remarks】
Preconditioning:Thermal treatmen（t at 150℃ for 1hr） Note1
＋0
Conditions for 1 cycle／ Step 1: Minimum operating temperature
℃ 30±3min.
－3
Step 2: Normal temperature
Step 3: Maximum operating temperature
Step 4: Normal temperature
2 to 3min.
＋0
－3
℃ 30±3min.
2 to 3min.
Number of cycles:5 times
Recovery : 24±2hrs under the standard condition Note3
14．Humidit（y Steady state）
Appearance:
No abnormality
Capacitance change: Within±15%
Specified Value
Dissipation factor :
7%ma（x HMK）, 5%ma（x QMK, SMK）.
Insulation resistance: 25MΩμF or 1000MΩ, whichever is smaller.
【Test Methods and Remarks】
Preconditioning:Thermal treatmen（t at 150℃ for 1hr） Note1
Temperature:40±2℃
Humidity：90 to 95%RH
＋24
Duration: 500
hrs
－0
Recovery : 24±2hrs under the standard condition Note3
15．Humidity Loading
Appearance:
No abnormality
Capacitance change: Within±15%
Specified Value
Dissipation factor:
7%ma（x HMK）, 5%ma（x QMK, SMK）.
Insulation resistance: 10MΩμF or 500MΩ, whichever is smaller.
【Test Methods and Remarks】
According to JIS 5102 clause 9.9.
Preconditioning:Voltage treatment Note2
Temperature:40±2℃
Humidity：90 to 95%RH
Applied voltage:Rated voltage
Charge/discharge current：50mA max.
Duration: 500 －＋204 hrs
Recovery : 24±2hrs under the standard condition Note3
16．High Temperature Loading
Appearance:
No abnormality
Capacitance change: Within±15%
Specified Value
Dissipation factor:
7%ma（x HMK）, 5%ma（x QMK, SMK）.
Insulation resistance: 50MΩμF or 1000MΩ, whichever is smaller.
【Test Methods and Remarks】
According to JIS 5102 clause 9.10.
Preconditioning:Voltage treatment Note2
Temperature:125±3℃（B7, C7）, 85±2℃（BJ）
Applied voltage:Rated voltage×2（HMK）
Rated voltage×1.5（QMK）
Rated voltage×1.2（SMK）
Charge/discharge current：50mA max.
＋24
Duration: 1000
hrs
－0
Recovery : 24±2hrs under the standard condition Note3
Note1 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for 24±2hours.
Note2 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and
kept at room temperature for 24±2hours.
Note3 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa
When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condi-
tion.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa
Unless otherwise specified, all the tests are conducted under the "standard condition".
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
mlcc06_reli_e-01
mlcc06_reli-R2
TAIYO YUDEN [ TAIYO YUDEN (U.S.A.), INC ]
