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V2N680-B-10 参数 Datasheet PDF下载

V2N680-B-10图片预览
型号: V2N680-B-10
PDF下载: 下载PDF文件 查看货源
内容描述: 高压贴片电容 [HIGH VOLTAGE CHIP CAPACITORS]
分类和应用: 高压
文件页数/大小: 8 页 / 258 K
品牌: SUPERWORLD [ SUPERWORLD ELECTRONICS ]
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HIGH VOLTAGE CHIP CAPACITORS  
V2N SERIES  
8. SOLDERIND AND MOUNTING :  
8-1 Re-flow Soldering :  
Preheat and gradual increase in temp. to the reflow temp. is recommended to decrease the potential of the thermal crack  
on the components. The recommended heating rate depends on the size of the component, however it should not  
exceed 3°C/sec.  
8-2 Wave Soldering :  
Most of the components are wave soldered with solder at 230~250°C. Adequate care must be taken to prevent the  
potential of thermal cracks on the ceramic capacitors. Refer to Figure 2 for optimum soldering benefits.  
8-3 Hand Soldering :  
Sudden temp. change in components, results in a temp. gradient, and therefore may cause internal thermal cracks in the  
components. In general a hand soldering method is not recommend unless proper preheating and handling practices have  
been taken. Care must also be taken not to touch the ceramic body of the capacitor with the tip of solder iron.  
How to solder repair by solder iron :  
1) Selection of soldering iron tip  
The required temp. of solder iron for any type of repair depends on the type of the tip, the substrate material, and the  
solder land size  
2) recommended solder iron condition  
a) Preheat substrate to (60°C~120°C).  
b) 350°C tip temperature (max)  
c) Never contact the ceramic with the iron tip  
d) 3.0mm tip diameter (max)  
e) Use a 30 watt (max.) soldering iron with tip diameter of 3.0mm  
f) Limit soldering time to 5 secs.  
Cooling condition :  
Natural cooling using air is recommended. If the chips are dipped into a solvent for cleaning, the temp. difference  
between the solvent and the chips must be less than 100°C.  
Preheating  
Soldering  
Natural  
cooling  
Preheating  
Soldering  
Natural  
cooling  
300  
250  
260  
217  
230  
200  
Over  
Over  
1min.  
Gradual Cooling  
70-90secs  
Over 2mins.  
Over 1min  
2-3secs.  
1min.  
Figure 1. Re-flow Soldering  
Figure 2. Wave Soldering  
Preheating  
Soldering  
Natural  
cooling  
350  
250  
200  
Within 5secs.  
Figure 3. Hand Soldering  
NOTE : Specifications subject to change without notice. Please check our website for latest information.  
15.01.2008  
SUPERWORLD ELECTRONICS (S) PTE LTD  
PG. 6