P3
Low Profile Power Inductors – L252010SF Series
7. Soldering
7-1: Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the
stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our
terminations are suitable for all re-flow soldering systems. If hand soldering cannot be avoided, the
preferred technique is the utilization of hot air soldering tools.
Note:
-If wave soldering is used, there will be some risk.
-Reflow soldering temperatures below 240°C, there will be non-wetting risk.
7-2: Solder Re-flow:
Recommended temperature profiles for re-flow soldering in Figure 1
7-3: Soldering Iron (Figure 2):
Products attachment with soldering iron is discouraged due to the inherent process control limitations.
In the event that a soldering iron must be employed the following precautions are recommended.
Note:
a) Preheat circuit and products to 150°C
b) 355°C tip temperature (Max.)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (Max.)
e) Use a 20watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 4-5 sec
Proprietary and Confidential
Document of Superworld
25/04/2016
SUPERWORLD [ SUPERWORLD ELECTRONICS ]
