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L1M-1N1S-10 参数 Datasheet PDF下载

L1M-1N1S-10图片预览
型号: L1M-1N1S-10
PDF下载: 下载PDF文件 查看货源
内容描述: 高频片式电感 [High Frequency Chip Inductor]
分类和应用:
文件页数/大小: 10 页 / 354 K
品牌: SUPERWORLD [ SUPERWORLD ELECTRONICS ]
 浏览型号L1M-1N1S-10的Datasheet PDF文件第2页浏览型号L1M-1N1S-10的Datasheet PDF文件第3页浏览型号L1M-1N1S-10的Datasheet PDF文件第4页浏览型号L1M-1N1S-10的Datasheet PDF文件第5页浏览型号L1M-1N1S-10的Datasheet PDF文件第6页浏览型号L1M-1N1S-10的Datasheet PDF文件第7页浏览型号L1M-1N1S-10的Datasheet PDF文件第8页浏览型号L1M-1N1S-10的Datasheet PDF文件第9页  
High Frequency Chip Inductor  
L1M SERIES  
9-2.1 Tape Dimension / 12mm  
Po:4± 0.1  
P2:2± 0.05  
t
D:1.5+0.1  
A
Series  
L
Size  
6
Bo(mm)  
4.95± 0.1  
4.95± 0.1  
Ao(mm)  
1.93± 0.1  
3.66± 0.1  
Ko(mm)  
1.93± 0.1  
1.85± 0.1  
P(mm)  
4.0± 0.1  
8.0± 0.1  
t(mm)  
D1(mm)  
1.5± 0.1  
1.5± 0.1  
0.24± 0.05  
0.24± 0.05  
7
P
Ao  
Ko  
A
D1:1.5± 0.1  
Section A-A  
9-3. Packaging Quantity  
Chip Size  
Chip / Reel  
Inner Box  
Middle Box  
Carton  
7
6
5
4(11)  
4(09)  
3(12)  
3(09)  
4000  
2
1
0
1000  
4000  
20000  
40000  
12000  
2000  
2500  
3000  
15000  
75000  
150000  
50000  
3000  
15000  
75000  
2000  
10000  
50000  
100000  
100000  
4000  
10000  
50000  
250000  
500000  
300000  
15000  
75000  
375000  
750000  
-
8000  
40000  
80000  
20000  
12500  
62500  
125000  
30000  
20000  
100000  
200000  
150000  
20000  
100000  
200000  
200000  
150000  
50000  
Bulk (Bags)  
9-4. Tearing Off Force  
The force for tearing off cover tape is 15 to 60 grams  
in the arrow direction under the following conditions.  
F
165° to 180°  
Room Temp.  
(° C)  
Room Humidity  
(%)  
Room atm Tearing Speed  
Top cover tape  
(hPa)  
(mm/min)  
5~35  
45~85  
860~1060  
300  
Base tape  
Application Notice  
1. Storage Conditions :  
To maintain the solderabililty of terminal electrodes :  
a) Temperature and humidity conditions : -10~ 40° C and 30~70% RH.  
b) Recommended products should be used within 6 months from the time of delivery.  
c) The packaging material should be kept where no chlorine or sulfur exists in the air.  
2. Transportation :  
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.  
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.  
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.  
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.  
10.11.2011  
PG. 10  
SUPERWORLD ELECTRONICS (S) PTE LTD