MOLDED WIREWOUND CHIP INDUCTORS
HWI252018 SERIES
5. GENERAL SPECIFICATION :
a) Temp. rise : 20° C Max.
b) Ambient temp. : 100° C Max.
c) Storage temp. : -40° C to +125° C
d) Operating temp. : -40° C to +125° C
e) Terminal strength : 0.5Kg Min.
f) Rated current : Current cause inductance drop within 10%
g) Resistance to solder heat : 260° C for 10secs
h) Resistance to solvent : Per MIL-STD-202F
6. RECOMMENDED REFLOW SOLDERING PROFILE :
6-1: Reflow soldering
Peak temperature
10s max
255
230
℃
℃
Natural
Cooling
180
℃
℃
150
40s max
90 to 120s
Pre-heating
Time(s)
6-2: Flow soldering
Peak temperature
10s max
260℃ max
Natural
Cooling
170
℃
℃
150
60 to 120s
Pre-heating
Time(s)
Tip temperature
Heating time
300~350° C
3 sec/soldering
Soldering rod specifications Output: 30W Tip diameter:1mm
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
30.10.2012
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2