CERAMIC CHIP INDUCTORS
C3 SERIES
9. SOLDERING AND MOUNTING :
9-1. Recommended PC Board Pattern
3.00
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
1.00
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
9-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
9-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
9-2.2 Solder Wave :
Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature
seen by the circuit when immersed in the molten solder wave. Due to the risk of thermal damage to products, wave
soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown
in Fig. 2
9-2.3 Soldering Iron (Figure 3) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 350°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Preheating
Soldering
20~40s
Natural
cooling
Preheating
Soldering
Natural
cooling
260
TP(260°C/10s max.)
217
245
150
200
150
60~150s
60~180s
480s max.
25
Gradual
Cooling
Time(sec.)
Over 2min.
Figure 1. Re-flow Soldering
Within 3s
Preheating
Soldering
Natural
cooling
Figure 2. Wave Soldering
3s
(max.)
350
10s
(max.)
330
150
Gradual
Cooling
Over 1min.
Figure 3. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
07.08.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
SUPERWORLD [ SUPERWORLD ELECTRONICS ]
