SMM150
Preliminary Information
PART MARKING – QFN PACKAGE
20 Ball Ultra CSPTM
28 Pad QFN
X is the sequential letter per wafer
Summit
(i.e. A for the first wafer, B for the second wafer,
SUMMIT
Part Number
C for the third wafer, etc.)
Ball A1
Status Tracking Code
(Blank, MS, ES, 01, 02,...)
(Summit Use)
Identifier
SMM150N SS
L AYYWW
Summit Part Number
Annn
Date Code (YYWW)
100% Sn, RoHS compliant,
Green
Pin 1
Lot tracking code (Summit use)
100% Sn, RoHS compliant, Green
Date Code
Part Number suffix
Drawing not
to scale
(Contains Customer specific
ordering requirements)
Y = Single digit year
Drawing not
to scale
(4=2004, 5=2005, etc)
Product Tracking Code (Summit use)
ORDERING INFORMATION
Summit
SMM150
nnn
V
N
C
V is the Lead-Free Attribute for the CSP
(E Package), L is for the QFN (N package)
Part
Number
Part Number Suffix (see page 19)
Package
Temp Range
Customer specific requirements are contained
C=Commercial
N=28 Pad QFN
in the suffix such as Hex code, Hex code
revision, etc.
E=20 Ball Ultra CSPTM
Blank=Industrial
NOTICE
NOTE 1 - This is a Preliminary Information data sheet that describes a Summit product currently in pre-production with limited characterization.
SUMMIT Microelectronics, Inc. reserves the right to make changes to the products contained in this publication in order to improve design,
performance or reliability. SUMMIT Microelectronics, Inc. assumes no responsibility for the use of any circuits described herein, conveys no license
under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained
herein reflect representative operating parameters, and may vary depending upon a user’s specific application. While the information in this
publication has been carefully checked, SUMMIT Microelectronics, Inc. shall not be liable for any damages arising as a result of any error or
omission.
SUMMIT Microelectronics, Inc. does not recommend the use of any of its products in life support or aviation applications where the failure or
malfunction of the product can reasonably be expected to cause any failure of either system or to significantly affect their safety or effectiveness.
Products are not authorized for use in such applications unless SUMMIT Microelectronics, Inc. receives written assurances, to its satisfaction, that:
(a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; and (c) potential liability of SUMMIT Microelectronics, Inc.
is adequately protected under the circumstances.
Revision 2.6
-
This document supersedes all previous versions.
Please check the Summit Microelectronics, Inc. web site at
www.summitmicro.com for data sheet updates.
© Copyright 2005 SUMMIT MICROELECTRONICS, Inc. PROGRAMMABLE ANALOG FOR A DIGITAL WORLD™
I C is a trademark of Philips Corporation, Ultra CSPTM is a registered name of FlipChip International, LLC.
2
Summit Microelectronics, Inc
2075 2.6 05/13/05
22
SUMMIT [ SUMMIT MICROELECTRONICS, INC. ]
