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SMH4042ASBLM 参数 Datasheet PDF下载

SMH4042ASBLM图片预览
型号: SMH4042ASBLM
PDF下载: 下载PDF文件 查看货源
内容描述: 分布式电源热插拔控制器的CompactPCI [Distributed Power Hot-Swap Controller for CompactPCI]
分类和应用: 控制器PC
文件页数/大小: 28 页 / 1819 K
品牌: SUMMIT [ SUMMIT MICROELECTRONICS, INC. ]
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SMH4042A  
GND(14)  
LOCAL_PCI_RST#(9)  
Powersupplyreturnline. Groundshouldbeappliedatthe  
same time as early power.  
An open-drain active-low output. It is used to reset the  
backendcircuitryontheadd-incard. Itisactivewhenever  
the card-side monitor inputs are below their respective  
VTRIP levels. It may also be driven low by a low input on  
the PCI_RST# pin.  
BD_SEL1#, BD_SEL2# (13, 12)  
These are active low TTL level inputs with internal pull-  
ups to VCC. When pulled low they indicate full board  
insertion. On the host side the signals should be directly LOCAL_PCI_RST (20)  
tied to ground. In a “High Availability” application these  
An open-drain (PFET) active-high output. It operates in  
inputs can be the last pins to mate with the backplane.  
Alternatively, they can be actively driven by the host, or  
beconnectedtoswitchesinterfacedtotheboardejectors,  
or any combination. Regardless, both inputs must be low  
before the SMH4042A will begin to turn on the backend  
voltage.  
parallel with LOCAL_PCI_RST#, providing an active high  
reset signal which is required by many 8051 style MCUs.  
It is active whenever the card-side monitor inputs are  
below their respective VTRIP levels. It may also be driven  
active by a low input on the PCI_RST# pin.  
SGNL_VLD# (16)  
DRVREN# (2)  
An open-drain, active-low output that indicates card side  
power is valid and the internal card side PCI_RST# timer  
has timed out.  
An open-drain, active-low output that indicates the status  
of the 3 volt and 5 volt high side driver outputs (VGATE5  
and VGATE3). This signal may also be used as a  
switching signal for the 12 volt supply.  
VGATE3 (22)  
FAULT# (4)  
A slew rate limited high side driver output for the 3.3V  
externalpowerFETgate. Theoutput-voltageisgenerated  
by an on-board charge pump.  
An open-drain, active-low output. It will be driven low  
whenever an over-current condition is detected. It will be  
reset at the same time that the VGATE outputs are turned VGATE5 (27)  
backonafteraresetfromthehostonthePWR_ENsignal.  
A slew rate limited high side driver output for the 5V  
HEALTHY# (15)  
externalpowerFETgate. Theoutputvoltageisgenerated  
by an on-board charge pump.  
An open-drain, active-low output indicating card side  
power inputs are above their reset trip levels.  
1VREF (5)  
This output provides a 1V reference for pre-charging the  
bus signal pins. Implementing a simple unity-gain ampli-  
fier circuit will allow pre-charging a large number of pins.  
RECOMMENDEDOPERATINGCONDITIONS*  
ABSOLUTE MAXIMUM RATINGS*  
TemperatureUnderBias......................... –55°Cto125°C  
StorageTemperature .............................. –65°Cto150°C  
LeadSolderTemperature(10secs) ..................... 300°C  
TemperatureRange(Industrial)...……....-40°Cto+85°C  
(Commercial)...……....-5° C to +70°C  
Supply Voltage………………….....….………2.7V to 5.5V  
Package Thermal Resistance (θ JA)  
Terminal Voltage with Respect to GND:  
CARD_3V_MON,CARD_5V_MON,  
28 Lead SOIC/SSOP...…………………………80oC/W  
Moisture Classification Level 1 (MSL 1) per J-STD- 020  
HST_3V_MON,SGNL_VLD#,HEALTHY#,  
LOCAL_PCI_RET#,V ........................................ 7V  
CC  
VGATE3,VGATE5,DRVREN# .................. 16V  
RELIABILITYCHARACTERISTICS  
DataRetention……………………………..…..100Years  
Endurance……………………….……….100,000Cycles  
RESET ............................................ V + 0.7V  
CC  
All Others ........................................ V + 0.7V  
CC  
Junction Temperature..........................................150°C  
Note * - The device is not guaranteed to function outside its operating  
rating. Stresses listed under Absolute Maximum Ratings may cause  
permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions  
outside those listed in the operational sections of this specification is  
not implied. Exposure to any absolute maximum rating for extended  
ESDRatingperJEDEC……………………………..2000V  
Latch-Up testing per JEDEC………………......+/- 100mA  
periods may affect device performance and reliability.  
2070 9.1 5/27/03  
SUMMIT MICROELECTRONICS, Inc.  
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