Qualiꢀkationsprüfungen
Qualiꢀcation tests
The qualiꢀcation of HR SMT Chip Inductances is done
according to AEC-Q200, Table 5 (inductive components),
MIL-STD-202, MIL 981 and ASTM E 595.
Die Qualiꢀkation der HR SMT Chipinduktivitäten erfolgt
nach AEC-Q200, Table 5 (induktive Bauelemente), MIL-
STD-202, MIL STD 981 und ASTM E 595.
AEC-Q200 Tab. 5
AEC-Q200 Tab. 5
Conditon
(referenced at Tab. 5)
No.
1
Test
Notes
JESD22 Method JB-100
and SUMIDA Components Spec.
Physical Dimensions
Electrical Characterization
AEC Q 200
and SUMIDA Components Spec
2
Temp.: -55°C / 25 °C / 125 °C
Solderability / Resistance to
dissolution of metallization
3
J-STD-002
1.8 kg for 60 sec.
(1,0 kg for 0603)
4
Terminal Strength
AEC-Q200-006
5
6
7
Board Flex
AEC-Q200-005
2 mm for 60 sec.
Resistance to Soldering Heat
High Temperature Exposure
J-STD-020
MIL-STD-202 Method 108
T = 125 °C (t = 1000 hrs.)
Temperature Cycling /
Thermal Shock
MIL-STD-202 Method 107
JESD22 Method JA-104
8
T = -55 / 125 °C (1000 cycles)
9
Biased Humidity
Mechanical Shock
Vibration
MIL-STD-202 Method 103
MIL-STD-202 Method 213
MIL-STD-202 Method 204
AEC-Q200-002
85 °C / 85% RH (t = 1000 hrs.)
10
11
12
13
Condition C
5 g
ESD
Resistance to Solvents
MIL-STD-202 Method 215
T = 125 °C
(t = 1000 hrs. with rated current)
14
Operational Life
MIL-PRF-27
15
16
Moisture Resistance
Sn Whisker
MIL-STD-202 Method 106
JESD22 Mehtod A104 JESD 201
Zusatzprüfungen
Additional tests
No.
17
18
19
20
21
Test
Mechanical Shock
Vibration
Conditon
Notes
Condition F
Condition H
MSL 1
MIL-STD-202 Method 213
MIL-STD-202 Method 204
J-STD-020
Moisture Sensitivity (MSL)
Outgassing
ASTM E 595
Resistance to Solvents
MIL-STD-202 Method 215
Bioact EC-7R Cleaner
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