VN750-E / VN750S-E / VN750PT-E / VN750B5-E
Figure 3. Configuration Diagram (Top View) & Suggested Connections for Unused and N.C. Pins
5
4
3
2
1
OUTPUT
STATUS
5
4
VCC
N.C.
OUTPUT
OUTPUT
VCC
STATUS
INPUT
GND
V
CC
INPUT
GND
8
1
2
SO-8
PENTAWATT
PPAK / P PAK
Connection / Pin Status N.C. Output
Input
Floating
X
X
X
X
X
To Ground
Through 10KΩ resistor
Figure 4. Current and Voltage Conventions
IS
VF
IIN
VCC
GND
INPUT
ISTAT
IOUT
VCC
STATUS
OUTPUT
VIN
VOUT
VSTAT
IGND
Table 4. Thermal Data
Value
PENTAWATT P PAK
Symbol
Parameter
Unit
2
S0-8
-
PPAK
R
Thermal Resistance Junction-case
Thermal Resistance Junction-lead
Max
Max
2.1
-
2.1
-
2.1
°C/W
°C/W
thj-case
R
30
-
thj-lead
1
3
3
93 ( )
62.1
62.1
52.1 ( )
77.1 ( ) °C/W
R
Thermal Resistance Junction-ambient Max
thj-amb
2
4
4
82 ( )
37 ( )
44 ( )
°C/W
1
2
( ) When mounted on a standard single-sided FR-4 board with 0.5cm of Cu (at least 35µm thick) connected to all V
pins. Horizontal
CC
mounting and no artificial air flow.
2
2
( ) When mounted on a standard single-sided FR-4 board with 2cm of Cu (at least 35µm thick) connected to all V pins. Horizontal mount-
CC
ing and no artificial air flow.
3
2
( ) When mounted on a standard single-sided FR-4 board with 0.5cm of Cu (at least 35µm thick). Horizontal mounting and no artificial air
flow.
4
2
( ) When mounted on a standard single-sided FR-4 board with 6cm of Cu (at least 35µm thick). Horizontal mounting and no artificial air flow.
3/31
STMICROELECTRONICS [ ST ]
