ULN2064B-ULN2066B-ULN2068B-ULN2070B-ULN2074B-ULN2076B
MOUNTING INSTRUCTIONS
The R
th j-amb
can be reduced by soldering the GND
pins to a suitable copper area of the printed circuit
board (Fig. 12) or to an external heatsink (Fig. 13).
The diagram of Figure 14 shows the maximum dis-
sipable power P
tot
and the R
th j-amb
as a function of
the side "α" of two equal square copper areas hav-
ing a thickness of 35
µ
(1.4 mils).
Figure 12 :
Example of P.C. Board Area which is
Used as Heatsink.
During soldering the pins temperature must not ex-
ceed 260 °C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 13 :
External Heatsink Mounting Example.
Figure 14 :
Maximum Dissipable Power and Junc-
tion to Ambient Thermal Resistance
vs. Side "α".
Figure 15 :
Maximum Allowable Power Dissipa-
tion vs. Ambient Temperature.
5/8
STMICROELECTRONICS [ STMICROELECTRONICS ]
