TEA2260 - TEA2261
PACKAGE MECHANICAL DATA
16 PINS - PLASTIC DIP
b1
b
B
e
E
Z
e3
D
9
8
16
1
Millimeters
Typ.
Inches
Typ.
Dimensions
Min.
Max.
Min.
0.020
0.030
Max.
a1
B
b
0.51
0.77
1.65
0.065
0.5
0.020
0.010
b1
D
E
e
0.25
20
0.787
8.5
0.335
0.100
0.700
2.54
17.78
e3
F
7.1
5.1
0.280
0.201
i
L
3.3
0.130
Z
1.27
0.050
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
© 1994 SGS-THOMSON Microelectronics - All Rights Reserved
Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips
I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to
the I2C Standard Specifications as defined by Philips.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco
The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
9/9
STMICROELECTRONICS [ ST ]
