TDA8172
Figure 2 :
AC Test Circuit
1N4001
V
S
C1
0.1
µ
F
2
V
REF
V
i
C2
470µF
D1
C3
220µF
t
fly
6
3
Iy
7
V
7
to
Ly
24.6mH
GND
R1
1
10kΩ
TDA8172
4
5
C4
0.22µF
R7
1.5
Ω
R4
R6
330
Ω
to
RT1
4.7kΩ
R3
IN
R2
5.6kΩ
12kΩ
Ry
9.6
Ω
C6
4.7
µ
F
8.2kΩ
C5
2200µF
R 5
Iy
8172-07.EPS
8172-08.EPS - 8172-09.EPS
*
Re comme nde d for
V
REF
filtering
R5
8.2
Ω
to
MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be re-
moved by adding an external heatsink.
Thanks to the HEPTAWATT
TM
package attaching
the heatsink is very simple, a screw or a compres-
sion spring (clip) being sufficient.
Figure 3 :
Mounting Examples
Between the heatsink and the package it is better
to insert a layer of silicon grease, to optimize the
thermal contact ; no electrical isolation is needed
between the two surfaces, since the tab is con-
nected to Pin 4 which is ground.
4/5
STMICROELECTRONICS [ STMICROELECTRONICS ]
