TDA7719
Package information
6
Package information
®
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK
®
packages. ECOPACK packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 21. TSSOP28 mechanical data and package dimensions
mm
inch
DIM.
OUTLINE AND
MECHANICAL DATA
MIN.
TYP. MAX. MIN.
1.200
TYP. MAX.
0.047
A
A1
A2
b
0.050
0.150 0.002
0.006
0.800 1.000 1.050 0.031 0.039 0.041
0.190
0.090
0.300 0.007
0.200 0.004
0.012
0.008
c
1
9.600 9.700 9.800 0.378 0.382 0.386
D
E
6.200 6.400 6.600 0.244 0.252 0.260
4.300 4.400 4.500 0.170 0.173 0.177
1
E1
e
L
0.650
0.450 0.600 0.750 0.018 0.024 0.030
1.000 0.039
0.026
L1
k
0˚ (min.), 8˚ (max.)
0.100
TSSOP28
Thin Shrink Small Outline Package
JEDEC MO-153-AC
aaa
0.004
Note: 1. D and E1 does not include mold flash or protrusions.
Mold flash or potrusions shall not exceed 0.15mm
(.006inch) per side.
0128292 B
43/45
STMICROELECTRONICS [ ST ]
