TDA2009A
MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be re-
moved by adding an external heatsink.
the heatsink is very simple, a screw or a compres-
sion spring (clip) being sufficient. Between the
heatsinkand thepackageitisbetter to inserta layer
of silicon grease, to optimize the thermal contact ;
no electrical isolation is needed between the two
Thanks to the MULTIWATT
package attaching
Figure 18 : Maximum Allowable Power Dissipa-
Figure 19 : Output Power versus Case
tion versus Ambient Temperature
Temperature
Figure 20 : Output Power and Drain Current ver-
sus Case Temperature
10/12
STMICROELECTRONICS [ ST ]
