TDA2003
PRATICAL CONSIDERATION
Printed circuit board
The layout shown in fig. 17 is recommended. If
different layouts are used, the ground points of
input 1 and input 2 must be well decoupled from
the ground of the output through which a ratherhigh
current flows.
Assembly suggestion
No electrical insulation is required between the
packageand the heat-sink.Pin length should be as
short as possible. The soldering temperature must
not exceed 260
°
C for 12 seconds.
Application suggestions
The recommended component values are those
shown in the application circuits of fig.16.
Different values can be used. The following table is
intended to aid the car-radio designer.
Component
C1
C2
C3
C4
C5
Recommmended
value
2.2
µF
470
µ
F
0.1
µ
F
1000
µ
F
0.1
µF
Purpose
Input DC
decoupling
Ripple rejection
Supply bypassing
Output coupling to load
Frequency stability
Larger than
recommended value
Smaller than
recommended value C1
Noise at switch-on,
switch-off
Degradation of SVR
Danger of oscillation
Higher low frequency
cutoff
Danger of oscillation at
high frequencies with
inductive loads
C
X
R1
R2
R3
≅
1
2
π
B R1
Upper frequency cutoff
Lower bandwidth
Larger bandwidth
(G
v
-1)
•
R2
2.2
Ω
1
Ω
Setting of gain
Setting of gain
and SVR
Frequency stability
Degradation of SVR
Increase of drain current
Danger of oscillation at
high frequencies with
inductive loads
Poor high frequency
attenuation
Danger of oscillation
R
X
≅
20 R2
Upper frequency cutoff
8/10
STMICROELECTRONICS [ STMICROELECTRONICS ]
