Package information
TDA2003A
4
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
Figure 26. Pentawatt (vertical) mechanical data and package dimensions
mm
inch
DIM.
MIN. TYP. MAX. MIN.
TYP. MAX.
0.188
0.054
0.11
OUTLINE AND
MECHANICAL DATA
A
C
D
D1
E
E1
F
F1
G
G1
H2
H3
L
L1
L2
L3
L4
L5
L6
L7
L9
L10
M
4.80
1.37
2.40
1.20
0.35
0.76
0.80
1.00
3.20
6.60
2.80 0.094
1.35 0.047
0.55 0.014
1.19 0.030
1.05 0.031
1.40 0.039
0.053
0.022
0.047
0.041
0.055
Weight: 2.00gr
3.40
6.80
3.60 0.126 0.134 0.142
7.00 0.260 0.267 0.275
10.40
10.40
0.41
0.409
17.55 17.85 18.15 0.691 0.703 0.715
15.55 15.75 15.95 0.612 0.620 0.628
21.2
22.3
21.4
22.5
21.6 0.831 0.843 0.850
22.7 0.878 0.886 0.894
1.29
0.051
0.118
0.622
0.260
0.106
0.189
2.60
15.10
6.00
2.10
4.30
4.23
3.75
3.00 0.102
15.80 0.594
6.60 0.236
2.70 0.083
4.80 0.170
4.5
4.0
4.75 0.167 0.178 0.187
4.25 0.148 0.157 0.187
40° (Typ.)
M1
V4
V5
DIA
Pentawatt V
90° (Typ.)
3.85 0.143
3.65
0.151
L
L1
E
M1
A
M
D
C
D1
V5
L2
L3
H2
L5
F
E1
E
V4
H3
G
G1
Dia.
F
F1
L9
L10
L7
H2
L4
V4
RESIN BETWEEN
LEADS
L6
PENTVME
0015981
16/19
Doc ID 018796 Rev 4
STMICROELECTRONICS [ ST ]
