TDA1175P
MOUNTING INSTRUCTION
The Rth (j-a) can be reduced by soldering the GND
pins to a suitable copper area of the printed circuit
board (Figure 5) or to an external heatsink (Fig-
ure 6).
having a thicknessof 35µ (1.4 mils).
During soldering the pins temperature must not
exceed 260°C and the soldering time must not be
longer than 12 seconds.
The diagram of Figure 7 shows the maximum
dissipable power Ptot and the Rth (j-a) as a function
of the side ”I” of two equal square copper areas
The external heatsinkor printed circuit copper area
must be connectedto electrical ground.
Figure 5 : Exampleof P.C. Board Copper Area
Figure 6 : External Heatsink Mounting Example
Figure 7 : Maximum Power Dissipation and
Junction-ambientThermal
Figure 8 : Maximum Allowable Power Dissipation
versus Ambient Temperature
Resistance versus ”I”
7/8
STMICROELECTRONICS [ ST ]
