STPS340U/S/B
Fig. 5:
Reverse leakage current versus reverse
voltage applied (Typical values).
Fig. 6:
Junction capacitance versus reverse
voltage applied (Typical values).
IR(A)
1E-2
Tj=150°C
C(pF)
500
F=1MHz
Tj=25°C
Tj=125°C
200
100
50
1E-3
Tj=100°C
1E-4
Tj=75°C
20
VR(V)
1E-5
0
5
10
15
20
25
30
35
40
10
1
2
5
VR(V)
10
20
50
Fig. 7:
Forward voltage drop versus forward
current (Maximum values).
Fig. 8-1:
Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy printed
circuit board FR4, copper thickness: 35µm) (SMB).
Rth(j-a) (°C/W)
120
10.00
IFM(A)
Typical values
Tj=150°C
100
Tj=125°C
1.00
80
60
0.10
VFM(V)
0.01
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
40
20
S(Cu) (cm²)
0
0
1
2
3
4
5
Fig. 8-2:
Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy printed
circuit board FR4, copper thickness: 35µm) (SMC).
Rth(j-a) (°C/W)
100
80
60
40
20
S(Cu) (cm²)
0
0
1
2
3
4
5
Fig. 8-3:
Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy printed
circuit board FR4, copper thickness: 35µm) (DPAK).
Rth(j-a) (°C/W)
100
80
60
40
20
S(Cu) (cm²)
0
0
2
4
6
8
10
12
14
16
18
20
4/7
STMICROELECTRONICS [ STMICROELECTRONICS ]
