STNRGPF01
Thermal data
6
Thermal data
The STNRG functionality cannot be guaranteed when the device, in operation, exceeds the
maximum chip junction temperature (T
).
Jmax
Equation 1
T
= T
+ (P
x J )
Dmax A
Jmax
Amax
Where:
is the maximum ambient temperature in °C
T
Amax
is the package junction to ambient thermal resistance in °C/W
JA
P
is the sum of P
and P
(P
= P
+ P
)
Dmax
INTmax
I/Omax
Dmax
INTmax
I/Omax
P
is the product of I and V , expressed in watts. This is the maximum chip internal
INTmax
DD
DD
power.
P
represents the maximum power dissipation on output pins where:
I/Omax
P
= (V x I ) + [(V - V ) x I ],
OL OL DD OH OH
I/Omax
taking into account the actual V /I and V /I of the I/Os at the low and high level.
OL OL
OH OH
Table 18. Package thermal characteristics
Parameter
Symbol
Value
Unit
JA
TSSOP38 - thermal resistance junction to ambient(1)
80
°C/W
1. Thermal resistance is based on the JEDEC JESD51-2 with the 4-layer PCB in natural convection.
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