STM8S003F3 STM8S003K3
Package information
10.2
TSSOP20 package information
Figure 47.TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,
package outline
1. Drawing is not to scale.
Table 53. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch,
package mechanical data
millimeters
Symbol
Min.
A
A1
A2
b
c
D
E
E1
e
L
L1
-
0.050
0.800
0.190
0.090
6.400
6.200
4.300
-
0.450
-
Typ.
-
-
1.000
-
-
6.500
6.400
4.400
0.650
0.600
1.000
Max.
1.200
0.150
1.050
0.300
0.200
6.600
6.600
4.500
-
0.750
-
Min.
-
0.0020
0.0315
0.0075
0.0035
0.2520
0.2441
0.1693
-
0.0177
-
Typ.
-
-
0.0394
-
-
0.2559
0.2520
0.1732
0.0256
0.0236
0.0394
Max.
0.0472
0.0059
0.0413
0.0118
0.0079
0.2598
0.2598
0.1772
-
0.0295
-
inches
(1)
DocID018576 Rev 5
91/103
98
STMICROELECTRONICS [ STMICROELECTRONICS ]
