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STM32F103R4T7TR 参数 Datasheet PDF下载

STM32F103R4T7TR图片预览
型号: STM32F103R4T7TR
PDF下载: 下载PDF文件 查看货源
内容描述: 基于ARM的低密度高性能线的32位MCU,具有16或32 KB闪存, USB , CAN ,6个定时器, 2的ADC ,6个通信接口 [Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 communication interfaces]
分类和应用: 闪存微控制器和处理器外围集成电路通信时钟
文件页数/大小: 80 页 / 1067 K
品牌: STMICROELECTRONICS [ ST ]
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STM32F103x4, STM32F103x6  
Electrical characteristics  
5
Electrical characteristics  
5.1  
Parameter conditions  
Unless otherwise specified, all voltages are referenced to V  
.
SS  
5.1.1  
Minimum and maximum values  
Unless otherwise specified the minimum and maximum values are guaranteed in the worst  
conditions of ambient temperature, supply voltage and frequencies by tests in production on  
100% of the devices with an ambient temperature at T = 25 °C and T = T max (given by  
A
A
A
the selected temperature range).  
Data based on characterization results, design simulation and/or technology characteristics  
are indicated in the table footnotes and are not tested in production. Based on  
characterization, the minimum and maximum values refer to sample tests and represent the  
mean value plus or minus three times the standard deviation (mean 3).  
5.1.2  
5.1.3  
Typical values  
Unless otherwise specified, typical data are based on T = 25 °C, V = 3.3 V (for the  
A
DD  
2 V V 3.6 V voltage range). They are given only as design guidelines and are not  
DD  
tested.  
Typical ADC accuracy values are determined by characterization of a batch of samples from  
a standard diffusion lot over the full temperature range, where 95% of the devices have an  
error less than or equal to the value indicated (mean 2).  
Typical curves  
Unless otherwise specified, all typical curves are given only as design guidelines and are  
not tested.  
5.1.4  
5.1.5  
Loading capacitor  
The loading conditions used for pin parameter measurement are shown in Figure 8.  
Pin input voltage  
The input voltage measurement on a pin of the device is described in Figure 9.  
Doc ID 15060 Rev 3  
27/80  
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