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STM32F103R4T6XXX 参数 Datasheet PDF下载

STM32F103R4T6XXX图片预览
型号: STM32F103R4T6XXX
PDF下载: 下载PDF文件 查看货源
内容描述: 基于ARM的低密度高性能线的32位MCU,具有16或32 KB闪存, USB , CAN ,6个定时器, 2的ADC ,6个通信接口 [Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 communication interfaces]
分类和应用: 闪存通信
文件页数/大小: 80 页 / 1067 K
品牌: STMICROELECTRONICS [ ST ]
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STM32F103x4, STM32F103x6  
Electrical characteristics  
5.3.17  
12-bit ADC characteristics  
Unless otherwise specified, the parameters given in Table 45 are derived from tests  
performed under the ambient temperature, f  
frequency and V  
supply voltage  
PCLK2  
DDA  
conditions summarized in Table 9.  
Note:  
It is recommended to perform a calibration after each power-up.  
Table 45. ADC characteristics  
Symbol  
Parameter  
Power supply  
Conditions  
Min  
Typ  
Max  
Unit  
VDDA  
2.4  
2.4  
3.6  
VDDA  
220(1)  
14  
V
V
(3)  
VREF+  
Positive reference voltage  
Current on the VREF input pin  
ADC clock frequency  
IVREF  
160(1)  
µA  
MHz  
(3)  
fADC  
0.6  
(2)  
Sampling rate  
0.05  
1
MHz  
fS  
f
ADC = 14 MHz  
823  
17  
kHz  
(2)  
External trigger frequency  
fTRIG  
1/fADC  
0 (VSSA tied to  
ground)  
(3)  
Conversion voltage range  
VREF+  
V
VAIN  
See Equation 1 and  
Table 46 for details  
(2)  
RAIN  
External input impedance  
Sampling switch resistance  
50  
1
k  
k  
pF  
(2)  
RADC  
Internal sample and hold  
capacitor  
(2)  
8
CADC  
fADC = 14 MHz  
fADC = 14 MHz  
fADC = 14 MHz  
5.9  
83  
µs  
1/fADC  
µs  
(2)  
Calibration time  
tCAL  
0.214  
3(4)  
Injection trigger conversion  
latency  
(2)  
tlat  
1/fADC  
µs  
0.143  
2(4)  
Regular trigger conversion  
latency  
(2)  
tlatr  
1/fADC  
µs  
f
f
ADC = 14 MHz  
ADC = 14 MHz  
0.107  
1.5  
0
17.1  
239.5  
1
(2)  
Sampling time  
Power-up time  
tS  
1/fADC  
µs  
(2)  
tSTAB  
0
1
18  
µs  
Total conversion time  
(including sampling time)  
(2)  
tCONV  
14 to 252 (tS for sampling +12.5 for  
successive approximation)  
1/fADC  
1. Based on characterization, not tested in production.  
2. Guaranteed by design, not tested in production.  
3. In devices delivered in VFQFPN and LQFP packages, VREF+ is internally connected to VDDA and VREF- is internally  
connected to VSSA. Devices that come in the TFBGA64 package have a VREF+ pin but no VREF- pin (VREF- is internally  
connected to VSSA), see Table 5 and Figure 4.  
4. For external triggers, a delay of 1/fPCLK2 must be added to the latency specified in Table 45.  
Doc ID 15060 Rev 3  
63/80  
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