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STM32F103R4 参数 Datasheet PDF下载

STM32F103R4图片预览
型号: STM32F103R4
PDF下载: 下载PDF文件 查看货源
内容描述: 基于ARM的低密度高性能线的32位MCU,具有16或32 KB闪存, USB , CAN ,6个定时器, 2的ADC ,6个通信接口 [Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 communication interfaces]
分类和应用: 闪存通信
文件页数/大小: 80 页 / 1067 K
品牌: STMICROELECTRONICS [ ST ]
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Electrical characteristics  
STM32F103x4, STM32F103x6  
Table 7.  
Symbol  
Current characteristics  
Ratings  
Max.  
Unit  
IVDD  
IVSS  
Total current into VDD/VDDA power lines (source)(1)  
Total current out of VSS ground lines (sink)(1)  
Output current sunk by any I/O and control pin  
Output current source by any I/Os and control pin  
Injected current on NRST pin  
150  
150  
25  
25  
5
IIO  
mA  
(2)(3)  
IINJ(PIN)  
Injected current on HSE OSC_IN and LSE OSC_IN pins  
Injected current on any other pin(4)  
5
5
Total injected current (sum of all I/O and control pins)(4)  
25  
(2)  
IINJ(PIN)  
1. All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power  
supply, in the permitted range.  
2. IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum  
cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A positive  
injection is induced by VIN > VDD while a negative injection is induced by VIN < VSS  
.
3. Negative injection disturbs the analog performance of the device. See note in Section 5.3.17: 12-bit ADC  
characteristics.  
4. When several inputs are submitted to a current injection, the maximum IINJ(PIN) is the absolute sum of the  
positive and negative injected currents (instantaneous values). These results are based on  
characterization with IINJ(PIN) maximum current injection on four I/O port pins of the device.  
Table 8.  
Thermal characteristics  
Ratings  
Symbol  
Value  
Unit  
TSTG  
TJ  
Storage temperature range  
–65 to +150  
150  
°C  
°C  
Maximum junction temperature  
5.3  
Operating conditions  
5.3.1  
General operating conditions  
Table 9.  
Symbol  
General operating conditions  
Parameter  
Conditions  
Min  
Max  
Unit  
fHCLK  
fPCLK1  
fPCLK2  
VDD  
Internal AHB clock frequency  
Internal APB1 clock frequency  
Internal APB2 clock frequency  
Standard operating voltage  
0
0
0
2
72  
36  
72  
3.6  
MHz  
V
Analog operating voltage  
(ADC not used)  
2
3.6  
Must be the same potential  
as VDD  
(1)  
VDDA  
V
V
(2)  
Analog operating voltage  
(ADC used)  
2.4  
1.8  
3.6  
3.6  
VBAT  
Backup operating voltage  
30/80  
Doc ID 15060 Rev 3  
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