Package characteristics
STM32F103x8, STM32F103xB
Figure 42. VFQFPN48 7 x 7 mm, 0.5 mm pitch, package Figure 43. Recommended footprint
outline
(1)
(dimensions in mm)
(1)(2)(3)
C
A2
A
ddd C
Seating
Plane
5.80
0.75
A3
A1
D
e
Pin no. 1 ID
R = 0.20
1
48
37
36
37
5.60
48
0.20
36
1
5.80
6.20
0.30
6.20
5.60
E2
b
e
E
12
13
24
25
0.55
0.50
L
7.30
ai15799
25
12
24
13
b
Bottom View
D2
L
V0_ME
1. Drawing is not to scale.
2. The back-side pad is not internally connected to the V
SS
or V
DD
power pads.
3. There is an exposed die pad on the underside of the VFQFPN package. It should be soldered to the PCB. All leads should
also be soldered to the PCB. It is recommended to connect it to V
SS
.
Table 51.
Symbol
VFQFPN48 7 x 7 mm, 0.5 mm pitch, package mechanical data
millimeters
Min
Typ
0.900
0.020
0.650
0.250
0.180
6.850
2.250
6.850
2.250
0.450
0.300
0.230
7.000
4.700
7.000
4.700
0.500
0.400
0.080
0.300
7.150
5.250
7.150
5.250
0.550
0.500
0.0071
0.2697
0.0886
0.2697
0.0886
0.0177
0.0118
Max
1.000
0.050
1.000
Min
0.0315
inches
(1)
Typ
0.0354
0.0008
0.0256
0.0098
0.0091
0.2756
0.1850
0.2756
0.1850
0.0197
0.0157
0.0031
0.0118
0.2815
0.2067
0.2815
0.2067
0.0217
0.0197
Max
0.0394
0.0020
0.0394
A
A1
A2
A3
b
D
D2
E
E2
e
L
ddd
0.800
1. Values in inches are converted from mm and rounded to 4 decimal digits.
78/96
Doc ID 13587 Rev 12
STMICROELECTRONICS [ STMICROELECTRONICS ]
