STM32F103xC, STM32F103xD, STM32F103xE
Package characteristics
Figure 63. LQFP144, 20 x 20 mm, 144-pin low-profile quad
Figure 64. Recommended
(1)
(1)(2)
flat package outline
footprint
Seating plane
C
A
A2 A1
c
b
1.35
73
0.25 mm
108
gage plane
ccc
C
109
72
0.35
D
k
D1
0.5
A1
D3
L
108
73
17.85
22.6
L1
19.9
72
109
144
37
E1
E
1
36
19.9
22.6
E3
ai149
144
37
Pin 1
identification
1
36
e
ME_1A
1. Drawing is not to scale.
2. Dimensions are in millimeters.
Table 67. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package mechanical data
millimeters
inches(1)
Symbol
Min
Typ
Max
Min
Typ
Max
0.063
A
A1
A2
b
1.60
0.15
0.05
1.35
0.002
0.0531
0.0067
0.0035
0.8583
0.7795
0.0059
0.0571
0.0106
0.0079
0.874
1.40
0.22
1.45
0.0551
0.0087
0.17
0.27
c
0.09
0.20
D
21.80
19.80
22.00
20.00
17.50
22.00
20.00
17.50
0.50
22.20
20.20
0.8661
0.7874
0.689
D1
D3
E
0.7953
21.80
19.80
22.20
20.20
0.8583
0.7795
0.8661
0.7874
0.689
0.874
E1
E3
e
0.7953
0.0197
0.0236
0.0394
3.5°
L
0.45
0°
0.60
0.75
7°
0.0177
0°
0.0295
7°
L1
k
1.00
3.5°
ccc
0.08
0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 14611 Rev 7
111/123
STMICROELECTRONICS [ ST ]
