Package characteristics
STM32F103xC, STM32F103xD, STM32F103xE
Figure 66. Recommended footprint
(1)(2)
Figure 65. LQFP100, 14 x 14 mm 100-pin low-profile
quad flat package outline
(1)
0.25 mm
0.10 inch
GAGE PLANE
k
75
D
D1
D3
75
76
51
51
L
L1
C
50
76
0.5
50
0.3
16.7
14.3
b
E3 E1 E
100
100
26
25
26
1.2
Pin 1
1
identification
e
1
ccc
C
25
12.3
A1
A2
A
SEATING PLANE
C
1L_ME
16.7
ai14906b
1. Drawing is not to scale.
2. Dimensions are in millimeters.
Table 68.
Symbol
LQPF100 – 14 x 14 mm 100-pin low-profile quad flat package mechanical data
millimeters
Min
Typ
Max
1.60
0.05
1.35
0.17
0.09
15.80
13.80
16.00
14.00
12.00
15.80
13.80
16.00
14.00
12.00
0.50
0.45
0.60
1.00
0°
3.5°
0.08
7°
0°
0.75
0.0177
16.20
14.20
0.622
0.5433
1.40
0.22
0.15
1.45
0.27
0.20
16.20
14.20
0.002
0.0531
0.0067
0.0035
0.622
0.5433
0.6299
0.5512
0.4724
0.6299
0.5512
0.4724
0.0197
0.0236
0.0394
3.5°
0.0031
7°
0.0295
0.6378
0.5591
0.0551
0.0087
Min
inches
(1)
Typ
Max
0.063
0.0059
0.0571
0.0106
0.0079
0.6378
0.5591
A
A1
A2
b
c
D
D1
D3
E
E1
E3
e
L
L1
k
ccc
1. Values in inches are converted from mm and rounded to 4 decimal digits.
112/123
Doc ID 14611 Rev 7
STMICROELECTRONICS [ STMICROELECTRONICS ]
