STM32F103x8, STM32F103xB
Package characteristics
Figure 40. VFQFPN36 6 x 6 mm, 0.5 mm pitch,
package outline
(1)
Seating plane
C
A2 A
ddd
C
Figure 41. Recommended footprint
(dimensions in mm)
(1)(2)(3)
4.30
1.00
27
19
A3
E2
b
27
19
A1
28
18
4.10
0.50
28
18
4.30
4.80
4.10
4.80
e
D
D2
36
10
0.75
1
9
36
0.30
10
1
E
9
L
ZR_ME
6.30
ai14870b
Pin # 1 ID
R = 0.20
1. Drawing is not to scale.
2. The back-side pad is not internally connected to the V
SS
or V
DD
power pads.
3. There is an exposed die pad on the underside of the VFQFPN package. It should be soldered to the PCB. All leads should
also be soldered to the PCB. It is recommended to connect it to V
SS
.
Table 50.
Symbol
VFQFPN36 6 x 6 mm, 0.5 mm pitch, package mechanical data
millimeters
Min
Typ
0.900
0.020
0.650
0.250
0.180
5.875
1.750
5.875
1.750
0.450
0.350
0.230
6.000
3.700
6.000
3.700
0.500
0.550
0.080
0.300
6.125
4.250
6.125
4.250
0.550
0.750
0.0071
0.2313
0.0689
0.2313
0.0689
0.0177
0.0138
Max
1.000
0.050
1.000
Min
0.0315
inches
(1)
Typ
0.0354
0.0008
0.0256
0.0098
0.0091
0.2362
0.1457
0.2362
0.1457
0.0197
0.0217
0.0031
0.0118
0.2411
0.1673
0.2411
0.1673
0.0217
0.0295
Max
0.0394
0.0020
0.0394
A
A1
A2
A3
b
D
D2
E
E2
e
L
ddd
0.800
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 13587 Rev 12
77/96
STMICROELECTRONICS [ STMICROELECTRONICS ]
