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STM32F103R4H6XXX 参数 Datasheet PDF下载

STM32F103R4H6XXX图片预览
型号: STM32F103R4H6XXX
PDF下载: 下载PDF文件 查看货源
内容描述: 基于ARM的低密度高性能线的32位MCU,具有16或32 KB闪存, USB , CAN ,6个定时器, 2的ADC ,6个通信接口 [Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 communication interfaces]
分类和应用: 闪存通信
文件页数/大小: 80 页 / 1067 K
品牌: STMICROELECTRONICS [ STMICROELECTRONICS ]
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STM32F103x4, STM32F103x6
Package characteristics
Figure 37. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package outline
B
A
A1
e
D
D1
A
F
H
G
F
E
E1
D
C
B
A
e
1
A3
A4
A2
Seating
C
plane
Bottom view
ME_R8
F
E
2
3
4
5
6
7
8
A1
ball
pad corner
Øb (64
balls)
1. Drawing is not to scale.
Table 52.
TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package
mechanical data
millimeters
inches
(1)
Max
1.200
0.150
0.785
0.200
0.600
0.250
4.850
0.300
5.000
3.500
4.850
5.000
3.500
0.500
0.750
0.080
0.150
0.050
5.150
0.1909
0.350
5.150
0.0098
0.1909
0.0118
0.1969
0.1378
0.1969
0.1378
0.0197
0.0295
0.0031
0.0059
0.0020
0.2028
0.0059
0.0309
0.0079
0.0236
0.0138
0.2028
Min
Typ
Max
0.0472
Symbol
Min
A
A1
A2
A3
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
Typ
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 15060 Rev 3
71/80