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STM32F103R4H6XXX 参数 Datasheet PDF下载

STM32F103R4H6XXX图片预览
型号: STM32F103R4H6XXX
PDF下载: 下载PDF文件 查看货源
内容描述: 基于ARM的低密度高性能线的32位MCU,具有16或32 KB闪存, USB , CAN ,6个定时器, 2的ADC ,6个通信接口 [Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 communication interfaces]
分类和应用: 闪存通信
文件页数/大小: 80 页 / 1067 K
品牌: STMICROELECTRONICS [ ST ]
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STM32F103x4, STM32F103x6  
Pinouts and pin description  
Alternate functions(4)  
Table 5.  
Pins  
Low-density STM32F103xx pin definitions (continued)  
Main  
Pin name  
function(3)  
(after reset)  
Default  
Remap  
5
6
5
C1  
D1  
2
3
-
PD0  
PD1  
PD2  
I/O FT OSC_IN(9)  
I/O FT OSC_OUT(9)  
6
54 B5  
I/O FT  
PD2  
TIM3_ETR  
TIM2_CH2 / PB3/  
TRACESWO  
SPI1_SCK  
39 55 A5 30  
PB3  
I/O FT  
JTDO  
TIM3_CH1 /PB4  
SPI1_MISO  
40 56 A4 31  
41 57 C4 32  
PB4  
PB5  
I/O FT  
I/O  
NJTRST  
PB5  
TIM3_CH2 /  
SPI1_MOSI  
I2C1_SMBA  
42 58 D3 33  
43 59 C3 34  
44 60 B4 35  
PB6  
PB7  
I/O FT  
I/O FT  
I
PB6  
PB7  
I2C1_SCL(8)  
I2C1_SDA(8)  
/
USART1_TX  
USART1_RX  
BOOT0  
BOOT0  
I2C1_SCL  
/CAN_RX  
45 61 B3  
46 62 A3  
-
-
PB8  
PB9  
I/O FT  
I/O FT  
PB8  
PB9  
I2C1_SDA /  
CAN_TX  
47 63 D4 36  
48 64 E4  
VSS_3  
VDD_3  
S
S
VSS_3  
VDD_3  
1
1. I = input, O = output, S = supply.  
2. FT = 5 V tolerant.  
3. Function availability depends on the chosen device. For devices having reduced peripheral counts, it is always the lower  
number of peripheral that is included. For example, if a device has only one SPI and two USARTs, they will be called SPI1  
and USART1 & USART2, respectively. Refer to Table 2 on page 9.  
4. If several peripherals share the same I/O pin, to avoid conflict between these alternate functions only one peripheral should  
be enabled at a time through the peripheral clock enable bit (in the corresponding RCC peripheral clock enable register).  
5. PC13, PC14 and PC15 are supplied through the power switch. Since the switch only sinks a limited amount of current  
(3 mA), the use of GPIOs PC13 to PC15 in output mode is limited: the speed should not exceed 2 MHz with a maximum  
load of 30 pF and these IOs must not be used as a current source (e.g. to drive an LED).  
6. Main function after the first backup domain power-up. Later on, it depends on the contents of the Backup registers even  
after reset (because these registers are not reset by the main reset). For details on how to manage these IOs, refer to the  
Battery backup domain and BKP register description sections in the STM32F10xxx reference manual, available from the  
STMicroelectronics website: www.st.com.  
7. Unlike in the LQFP64 package, there is no PC3 in the TFBGA64 package. The VREF+ functionality is provided instead.  
8. This alternate function can be remapped by software to some other port pins (if available on the used package). For more  
details, refer to the Alternate function I/O and debug configuration section in the STM32F10xxx reference manual,  
available from the STMicroelectronics website: www.st.com.  
9. The pins number 2 and 3 in the VFQFPN36 package, 5 and 6 in the LQFP48 and LQFP64 packages and C1 and C2 in the  
TFBGA64 package are configured as OSC_IN/OSC_OUT after reset, however the functionality of PD0 and PD1 can be  
remapped by software on these pins. For more details, refer to the Alternate function I/O and debug configuration section  
in the STM32F10xxx reference manual.  
Doc ID 15060 Rev 3  
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