Package characteristics
STM32F103x8, STM32F103xB
Figure 35. VFQFPN36 6 x 6 mm, 0.5 mm pitch,
Figure 36. Recommended footprint
(1)
(1)(2)(3)
package outline
(dimensions in mm)
Seating plane
C
ddd
C
1.00
4.30
A2
A
27
19
A1
A3
28
E2
18
b
0.50
4.10
27
19
18
4.30
28
4.10
4.80
4.80
e
D2
D
36
10
0.75
9
1
0.30
36
10
6.30
ai14870b
1
9
Pin # 1 ID
R = 0.20
L
E
ZR_ME
1. Drawing is not to scale.
2. The back-side pad is not internally connected to the VSS or VDD power pads.
3. There is an exposed die pad on the underside of the VFQFPN package. It should be soldered to the PCB. All leads should
also be soldered to the PCB. It is recommended to connect it to VSS
.
Table 50. VFQFPN36 6 x 6 mm, 0.5 mm pitch, package mechanical data
millimeters
inches(1)
Symbol
Min
Typ
Max
Min
Typ
Max
A
0.800
0.900
0.020
0.650
0.250
0.230
6.000
3.700
6.000
3.700
0.500
0.550
0.080
1.000
0.050
1.000
0.0315
0.0354
0.0008
0.0256
0.0098
0.0091
0.2362
0.1457
0.2362
0.1457
0.0197
0.0217
0.0031
0.0394
0.0020
0.0394
A1
A2
A3
b
0.180
5.875
1.750
5.875
1.750
0.450
0.350
0.300
6.125
4.250
6.125
4.250
0.550
0.750
0.0071
0.2313
0.0689
0.2313
0.0689
0.0177
0.0138
0.0118
0.2411
0.1673
0.2411
0.1673
0.0217
0.0295
D
D2
E
E2
e
L
ddd
1. Values in inches are converted from mm and rounded to 4 decimal digits.
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Doc ID 13587 Rev 11
STMICROELECTRONICS [ ST ]
