Package characteristics
STM32F103x8, STM32F103xB
6.2
Thermal characteristics
The maximum chip junction temperature (T max) must never exceed the values given in
J
Table 9: General operating conditions on page 35.
The maximum chip-junction temperature, T max, in degrees Celsius, may be calculated
J
using the following equation:
T max = T max + (P max × )
J
A
D
JA
Where:
●
●
●
●
T max is the maximum ambient temperature in C,
A
is the package junction-to-ambient thermal resistance, in C/W,
JA
P max is the sum of P
max and P max (P max = P
max + P max),
INT I/O
D
INT
I/O
D
P
max is the product of I and V , expressed in Watts. This is the maximum chip
DD DD
INT
internal power.
P
max represents the maximum power dissipation on output pins where:
I/O
P
max = (V × I ) + ((V – V ) × I ),
OL OL DD OH OH
I/O
taking into account the actual V / I and V / I of the I/Os at low and high level in the
OL OL
OH OH
application.
Table 56. Package thermal characteristics
Symbol
Parameter
Value
Unit
Thermal resistance junction-ambient
LFBGA100 - 10 × 10 mm / 0.8 mm pitch
44
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
46
45
65
55
18
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
JA
°C/W
Thermal resistance junction-ambient
TFBGA64 - 5 × 5 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP48 - 7 x 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 36 - 6 × 6 mm / 0.5 mm pitch
6.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
82/92
Doc ID 13587 Rev 11
STMICROELECTRONICS [ ST ]
