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STM32F100C8T6BTR 参数 Datasheet PDF下载

STM32F100C8T6BTR图片预览
型号: STM32F100C8T6BTR
PDF下载: 下载PDF文件 查看货源
内容描述: 低和中等密度值线,先进的基于ARM的32位MCU低和中等密度值线,先进的基于ARM的32位MCU [Low & medium-density value line, advanced ARM-based 32-bit MCU Low & medium-density value line, advanced ARM-based 32-bit MCU]
分类和应用:
文件页数/大小: 84 页 / 1148 K
品牌: STMICROELECTRONICS [ ST ]
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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB  
Pinouts and pin description  
Alternate functions(3)(4)  
Table 4.  
Pins  
STM32F100xx pin definitions (continued)  
Main  
Pin name  
function(3)  
Default  
Remap  
(after reset)  
PB4 / TIM3_CH1  
SPI1_MISO  
90 56 A4 40  
91 57 C4 41  
92 58 D3 42  
PB4  
PB5  
PB6  
I/O FT  
I/O  
NJTRST  
PB5  
TIM3_CH2 /  
SPI1_MOSI  
I2C1_SMBA / TIM16_BKIN  
I2C1_SCL(12)/ TIM4_CH1(10)(12)  
TIM16_CH1N  
I/O FT  
PB6  
USART1_TX  
USART1_RX  
I2C1_SDA(12)/ TIM17_CH1N  
TIM4_CH2(10)(12)  
93 59 C3 43  
94 60 B4 44  
95 61 B3 45  
PB7  
BOOT0  
PB8  
I/O FT  
I
PB7  
BOOT0  
PB8  
TIM4_CH3(10)(12)  
TIM16_CH1(12) / CEC(12)  
/
I/O FT  
I2C1_SCL  
I2C1_SDA  
TIM4_CH4(10)(12)  
TIM17_CH1(12)  
/
96 62 A3 46  
PB9  
I/O FT  
PB9  
97  
98  
-
-
-
-
-
-
PE0  
PE1  
I/O FT  
PE0  
PE1  
TIM4_ETR(10)  
I/O FT  
99 63 D4 47  
100 64 E4 48  
VSS_3  
VDD_3  
S
S
VSS_3  
VDD_3  
1. I = input, O = output, S = supply, HiZ= high impedance.  
2. FT= 5 V tolerant.  
3. Function availability depends on the chosen device. For devices having reduced peripheral counts, it is always the lower  
number of peripherals that is included. For example, if a device has only one SPI, two USARTs and two timers, they will be  
called SPI1, USART1 & USART2 and TIM2 & TIM 3, respectively. Refer to Table 2 on page 11.  
4. If several peripherals share the same I/O pin, to avoid conflict between these alternate functions only one peripheral should  
be enabled at a time through the peripheral clock enable bit (in the corresponding RCC peripheral clock enable register).  
5. PC13, PC14 and PC15 are supplied through the power switch and since the switch only sinks a limited amount of current  
(3 mA), the use of GPIOs PC13 to PC15 in output mode is restricted: the speed should not exceed 2 MHz with a maximum  
load of 30 pF and these IOs must not be used as a current source (e.g. to drive an LED).  
6. Main function after the first backup domain power-up. Later on, it depends on the contents of the Backup registers even  
after reset (because these registers are not reset by the main reset). For details on how to manage these IOs, refer to the  
Battery backup domain and BKP register description sections in the STM32F10xxx reference manual, available from the  
STMicroelectronics website: www.st.com.  
7. Unlike in the LQFP64 package, there is no PC3 in the TFBGA64 package. The VREF+ functionality is provided instead.  
8. I2C2 is not present on low-density value line devices.  
9. SPI2 is not present on low-density value line devices.  
10. TIM4 is not present on low-density value line devices.  
11. The pins number 2 and 3 in the VFQFPN36 package, 5 and 6 in the LQFP48 and LQFP64 packages and C1 and C2 in the  
TFBGA64 package are configured as OSC_IN/OSC_OUT after reset, however the functionality of PD0 and PD1 can be  
remapped by software on these pins. For more details, refer to the Alternate function I/O and debug configuration section in  
the STM32F10xxx reference manual.  
12. This alternate function can be remapped by software to some other port pins (if available on the used package). For more  
details, refer to the Alternate function I/O and debug configuration section in the STM32F10xxx reference manual, available  
from the STMicroelectronics website: www.st.com.  
Doc ID 16455 Rev 2  
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