Package characteristics
STM32F103xC, STM32F103xD, STM32F103xE
6
Package characteristics
6.1
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
Figure 58. Recommended PCB design rules (0.80/0.75 mm pitch BGA)
Dpad
0.37 mm
0.52 mm typ. (depends on solder mask
registration tolerance
Dsm
Solder paste
0.37 mm aperture diameter
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
Dpad
Dsm
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Doc ID 14611 Rev 7
STMICROELECTRONICS [ ST ]
