STM32F103xC, STM32F103xD, STM32F103xE
Package characteristics
(1)(2)
Figure 67. LQFP64 – 10 x 10 mm 64 pin low-profile
Figure 68. Recommended footprint
(1)
quad flat package outline
A
48
33
A2
0.3
A1
49
32
0.5
b
12.7
E
E1
10.3
e
10.3
64
17
1.2
1
16
D1
D
c
7.8
L1
12.7
L
ai14909
ai14398b
1. Drawing is not to scale.
2. Dimensions are in millimeters.
Table 69. LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package mechanical data
millimeters
Typ
inches(1)
Symbol
Min
Max
Min
Typ
Max
A
A1
A2
b
1.60
0.15
1.45
0.27
0.20
0.0630
0.0059
0.0571
0.0106
0.0079
0.05
1.35
0.17
0.09
0.0020
0.0531
0.0067
0.0035
1.40
0.22
0.0551
0.0087
c
D
12.00
10.00
12.00
10.00
0.50
0.4724
0.3937
0.4724
0.3937
0.0197
3.5°
D1
E
E1
e
0°
3.5°
7°
0°
7°
L
0.45
0.60
0.75
0.0177
0.0236
0.0394
0.0295
L1
1.00
Number of pins
64
N
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 14611 Rev 7
113/123
STMICROELECTRONICS [ ST ]
