STM32F103x8, STM32F103xB
Package characteristics
Figure 43. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package outline
B
D
D1
A
A
e
F
A1
H
G
F
F
E
D
C
B
A
E1
E
e
1
2
3
4
5
6
7
8
Øb (64 balls)
A1 ball pad corner
A3
A4
A2
Seating
plane
C
Bottom view
ME_R8
1. Drawing is not to scale.
Table 54. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package
mechanical data
millimeters
Typ
inches(1)
Symbol
Min
Max
Min
Typ
Max
A
1.200
0.0472
A1
A2
A3
A4
b
0.150
0.0059
0.785
0.200
0.0309
0.0079
0.600
0.350
5.150
0.0236
0.0138
0.2028
0.250
4.850
0.300
5.000
3.500
5.000
3.500
0.500
0.750
0.080
0.150
0.050
0.0098
0.1909
0.0118
0.1969
0.1378
0.1969
0.1378
0.0197
0.0295
0.0031
0.0059
0.0020
D
D1
E
4.850
5.150
0.1909
0.2028
E1
e
F
ddd
eee
fff
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 13587 Rev 11
79/92
STMICROELECTRONICS [ ST ]
